Assist feature placement using a process-sensitivity model

Details Assist feature placement using a process-sensitivity model Assist feature placement using a process-sensitivity model

2006-05-12

2008-09-02

Chiang, Jack (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C716S030000

Reexamination Certificate

active

07421678

ABSTRACT:
One embodiment of the present invention provides a system that determines an assist feature placement. During operation, the system receives an initial assist feature placement for a layout. Next, the system determines assist feature perturbations using the initial assist feature placement. An assist feature perturbation typically comprises a few simple polygons. The system then determines perturbation values at evaluation points in the layout using the assist feature perturbations and an analytical model. If a process-sensitivity model is used, the perturbation value at an evaluation point is associated with the change in the through-process window at that point in the layout. Next, the system determines a change in the value of an objective function using the perturbation values. The objective function can be indicative of the overall manufacturability of the layout. The system then determines an assist feature placement using the change in the value of the objective function. For example, the system can determine an assist feature placement using an assist feature perturbation which minimizes the objective function value.

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Schellenberg et al., Adoption of OPC and the impact on design and layout, Jun. 2001, ACM/IEEE, pp. 89-92.
Gupta et al., Detailed Placement for Improved Depth of Focus and CD Control, Jan. 2005, ACM/IEEE pp. 343-348.

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