Assembly of a recessed heat sink and a semiconductor device seal

Details Assembly of a recessed heat sink and a semiconductor device seal Assembly of a recessed heat sink and a semiconductor device seal

1974-12-30

1977-02-08

James, Andrew J.

357 72, 357 74, 357 79, H01L 2328, H01L 2302, H01L 2312, H01L 2342

Patent

active

040074773

ABSTRACT:
A semi-conductor assembly includes a conductive stud and a semi-conductor device mounted on the stud so that a first contact area of the device is thermally and electrically connected thereto. Thermally and electrically connected to a second contact area of the device is an expanded head portion of an electrical lead. A body is shaped to define a recess in which the stud is engaged so that the device is accommodated in the space defined between the stud and the walls of the recess, the electrical lead extending through an aperture in one of said walls. Sealing means prevents ingress of foreign material through the aperture into said space, and a resilient member is trapped and deformed between the head portion of the lead and the body so that the head portion of the lead is urged into pressure contact with the device.

REFERENCES:
patent: 3176382 (1965-04-01), Dickson et al.
patent: 3449506 (1969-06-01), Weinstein et al.
patent: 3474302 (1969-10-01), Blundell
patent: 3513360 (1970-05-01), Andersson et al.
patent: 3743896 (1973-07-01), Weiske et al.

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