Assembly-heat sink for semiconductor devices

Details Assembly-heat sink for semiconductor devices Assembly-heat sink for semiconductor devices

1982-10-22

1985-05-21

James, Andrew J.

357 79, 357 74, 357 75, H01L 2334, H01L 2302, H01L 2304, H01L 2504

Patent

active

045189838

ABSTRACT:
The present invention is directed to an assembly-heat sink for semiconductor fusions. The fusions are disposed within the assembly-heat sink between cylindrical metal members which both cool the fusions and facilitate making electrical contact to the fusions. Top and bottom members of the assembly-heat sink, which entirely enclose the cylindrical members and the fusions are comprised entirely of metal permitting the assembly-heat sink to be cooled from three sides. The fusions are electrically insulated from the top and bottom members of the assembly-heat sink.

REFERENCES:
patent: 4218695 (1980-08-01), Egerbacher et al.
patent: 4414562 (1983-11-01), Kiley et al.

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