Assembly for wafer handling system

Handling: hand and hoist-line implements – Contact lens applicator

Reexamination Certificate

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Details

C414S941000

Reexamination Certificate

active

06260894

ABSTRACT:

BACKGROUND OF THE INVENTION
This invention relates to mechanical wafer handling systems for semiconductor processing equipment.
Mechanical wafer handling systems transport wafers from wafer carriers to processing chambers and vice versa. Various fabrication processes are carried out in processing chambers, including annealing, oxidation, nitridation, etching, and deposition. The wafer handling system might include a robot, an arm operated by the robot, and an implement at the end of the arm to hold the wafer.
Before processing, a wafer may be at room temperature, while in a wafer carrier. During processing, the temperature of a wafer may rise to 1200° C. or higher. Thus, a wafer may be extracted from the chamber while still hot, e.g. 550° C. to 750° C. or higher. Thus, the implement for holding the wafer needs to handle wafers of various temperatures, including hot wafers.
SUMMARY OF THE INVENTION
In general, in one aspect, the invention features a blade for a mechanical wafer handling system. An elongated planar member has a central region. A first array of openings and a second array of openings are provided within the central region. The openings of the first array are arranged substantially symmetrically to the openings of the second array on opposing sides of a central longitudinal axis extending along the length of the planar member and passing through a center point of the central region. The openings in the first array are arranged substantially symmetrically with respect to a perpendicular axis extending along the width of the elongated planar member and passing through a center point of the central region. The openings in the second array are also arranged substantially symmetrically with respect to the perpendicular axis.
Embodiments may include one or more of the following. The first array of openings and the second array of openings comprise two circular openings and two oval openings. One short end of the elongated planar member has a notch. The planar member has a peripheral opening positioned between the openings of the first and second arrays of openings and a second short end of the elongated planar member. Opposing short ends of the elongated planar member have ledges to support a wafer. The elongated planar member is made out of quartz.
In another aspect, the invention features a blade assembly for a mechanical wafer handling system. The assembly includes an elongated planar member with a central region. The central region has a first array of openings and a second array of openings. The openings of the first array are arranged substantially symmetrically to the openings of the second array on opposing sides of a central longitudinal axis extending along the length of the planar member and passing through a center point of the central region. The openings in the first array are arranged substantially symmetrically with respect to a perpendicular axis extending along the width of the elongated planar member and passing through a center point of the central region. The openings in the second array are also arranged substantially symmetrically with respect to the perpendicular axis. The assembly also includes a wrist upper cap having a first and a second wing support on two opposing sides of the upper cap and a first non-supporting narrow ridge extending between the first and second wing supports. Further, the assembly includes a wrist lower cap having a third and a fourth wing support on two opposing sides of the lower cap with a second non-supporting narrow ridge extending between the third and the fourth wing supports. The wrist upper cap is attached to a top surface of the planar member and the wrist lower cap is attached to a bottom surface of the planar member when the blade assembly is assembled.
Embodiments may also include one or more of the following. The elongated planar member and the first, second, third, and fourth wing supports have screw holes. The screw holes are arranged so that the screw holes in the planar member are aligned with the screw holes in the first, second, third, and fourth wing supports when the blade assembly is assembled. The first ridge and the second ridge are each less than ⅛ thick. The upper and the lower wrist caps are each made out of stainless steel. The upper and lower caps are each coated with anodized nickel.
An advantage of the blade is that its arrays of openings significantly reduce the thermal gradients which occur across the hot wafer when it is picked up by the blade. Further, the construction of the wrist assembly substantially reduces its points of contact with the blade, thereby reducing the heat sink effect of the wrist assembly. Finally, the ridges of the transition between the wrist assembly and the blade act as a barrier which prevents particles from reaching the wafer while it rests on the blade.
Further aspects, features, and advantages will be found in the following.


REFERENCES:
patent: 5622400 (1997-04-01), George
patent: 5669644 (1997-09-01), Kaihotsu et al.
patent: 5700046 (1997-12-01), Van Doren et al.
patent: 5711646 (1998-01-01), Ueda et al.
patent: 5746460 (1998-05-01), Marohl et al.
patent: 5789878 (1998-08-01), Kroeker et al.
patent: 5980194 (1999-11-01), Freerks et al.

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