Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With workpiece support
Reexamination Certificate
2005-05-31
2005-05-31
Mills, Gregory (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With workpiece support
C156S345510, C156S345540, C156S345550, C118S724000, C118S728000, C118S729000, C118S730000, C118S731000, C204S298010, C269S020000, C062S404000
Reexamination Certificate
active
06899788
ABSTRACT:
An article (e.g. a semiconductor wafer) is held in an article holder by means of a number of gas flows emitted from gas vortex chambers. Some of the gas flows act to cool an adjacent article portion more than the other gas flows. For example, some of the vortex chambers emit more gas per unit of time than the other chambers. More cooling is provided to those portions of the article which are heated more during processing. Greater temperature uniformity can be achieved.
REFERENCES:
patent: 6168697 (2001-01-01), Siniaguine et al.
patent: 97/45862 (1997-12-01), None
patent: 00/70659 (2000-11-01), None
Kackar Ram N
MacPherson Kwok & Chen & Heid LLP
Mills Gregory
Shenker Michael
Tru-Si Technologies Inc.
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