Thermal measuring and testing – Temperature measurement – By electrical or magnetic heat sensor
Reexamination Certificate
2007-04-03
2007-04-03
Gutierrez, Diego (Department: 2859)
Thermal measuring and testing
Temperature measurement
By electrical or magnetic heat sensor
C374S170000
Reexamination Certificate
active
11009969
ABSTRACT:
In an arrangement for determining a temperature loading during a soldering process, a semiconductor chip (1) comprises at least one contact (2) to be soldered or is electrically conductively connected to at least one contact (14d) to be soldered that is situated outside the semiconductor chip. The semiconductor chip (1) furthermore comprises a temperature sensor device (3), which determines a measurement quantity corresponding to the temperature. A processing device (4, 5) has an analog-to-digital converter (5), which is electrically conductively connected to the temperature sensor device (3) and converts the measurement quantity into at least one storable signal that represents the temperature loading. A voltage supply device (10), which is electrically conductively connected to the temperature sensor device (3) and the processing device (4, 5), supplies these components with an operating voltage. A data memory (6) serves for storing the at least one storable signal. An electrical line (7, 11) connected to the data memory (6) serves for outputting the stored signal. As a result, it is possible to monitor temperature loadings of the semiconductor chip also outside the sphere of influence of the semiconductor manufacturer.
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Auge Jürgen
Huber Thomas
Pröll Manfred
Schröder Stephan
Gutierrez Diego
Infineon - Technologies AG
Jagan Mirellys
Slater & Matsil L.L.P.
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