Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1989-09-13
1990-11-27
Lee, John D.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156647, 156656, 20419235, 350 9617, G02B 630
Patent
active
049731335
ABSTRACT:
A coupling arrangement for coupling an optical fiber to a planar integrated optical component characterized by a V-shaped groove being formed in a surface of the substrate, at least one end of the groove being closed by a vertical substrate wall containing an optical window formed by an end of an integrated optical component in said substrate, and an end of an optical fiber being secured in said groove with an end face being positioned adjacent said optical window. The arrangement is preferably made by etching oblique channels into a substrate containing the optical component to form a bridge extending parallel with the optical component, the bridge is then removed to expose an optical window in a substantially vertically extending wall, and then the optical fiber is positioned and secured in the groove with the end face of the fiber being positioned adjacent the optical window.
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Bowers et al., "Etching of Deep Grooves for the Precise Positioning of Cleaves in Semiconductor Lasers" Applied Physic Letter, vol. 46, No. 5, Mar. 1, 1985, pp. 453-455.
Matz Richard
Winzer Gerhard
Lee John D.
Siemens Aktiengesellschaft
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