Arrangement and method for fabricating a semiconductor wafer

Details Arrangement and method for fabricating a semiconductor wafer Arrangement and method for fabricating a semiconductor wafer

2001-08-30

2009-10-13

Deo, Duy-Vu (Department: 1792)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S689000, C438S690000, C216S037000, C216S074000, C216S079000, C216S088000, C216S089000

Reexamination Certificate

active

07601643

ABSTRACT:
An arrangement and method for fabricating a semiconductor wafer which utilizes a nonaqueous solvent rinse is disclosed.

REFERENCES:
patent: 3874129 (1975-04-01), Deckert et al.
patent: 4064660 (1977-12-01), Lampert
patent: 5318927 (1994-06-01), Sandhu et al.
patent: 5733177 (1998-03-01), Tsuchiya et al.
patent: 5780358 (1998-07-01), Zjou et al.
patent: 5869392 (1999-02-01), Kimura
patent: 5934980 (1999-08-01), Koos et al.
patent: 5985045 (1999-11-01), Kobayashi
patent: 6001730 (1999-12-01), Farkas et al.
patent: 6106728 (2000-08-01), Iida et al.
patent: 6126514 (2000-10-01), Muroyama
patent: 6436830 (2002-08-01), Merchant et al.
patent: 08330262 (1966-12-01), None
patent: 2001139935 (2001-05-01), None
Muroyama et al., Slurry for Polsihing and Manufacture of Semiconductor Device, Dec. 13, 1996, English Abstract of JP 08330262 A2, 2 pp.
Muroyama et al. Slurry for Polsihing, and Manufacture of Semiconductor Device, Dec. 13, 1996, Computer translation of JP 08330262 A., 5 pp.
Ri et al., Composition for Polishing, May 22, 2001, English Abstract of JP 20001139935-A, 1 page.
Ri et al., Composition for Polishing, May 22, 2001, Computer translation of JP 20001139935-A into English, 8 pp.

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