Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1997-02-21
1999-03-30
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257668, 257738, 257787, H01L 2348, H01L 23495, H01L 2328
Patent
active
058893326
ABSTRACT:
A chip-scale packaged integrated circuit and fabrication method are disclosed in which a semiconductor die and a rigid carrier of substantially identical geometric shape and size are aligned to form a packaged IC in which the die and carrier have a substantially 1:1 area ratio. A narrow gap between the die and carrier is bridged by the contact interconnections. An underfill material filling the gap and bonded to the die and carrier faces to relieve thermal expansion mismatch stresses. A fillet on one or more sides of the package is generally T-shaped in cross-section and nearly flat to the aligned side faces of the die and carrier. A fixture to facilitate fabrication of the package has a cavity with beveled sidewalls and seal which hold the die and carrier and form a narrow trough along the gap to receive and hold the underfill material adjacent the gap. The seal and cavity sidewalls have a surface to which the underfill material is nonadherent.
REFERENCES:
patent: 5461197 (1995-10-01), Hiruta et al
patent: 5621225 (1997-04-01), Shieh et al.
patent: 5704116 (1998-01-01), Gamota et al.
Tanagawa et al., "The Resin Molded Chip Size Package (MCSP", 2 Oct. 1995, 17th. IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, Oct. 2-4, 1995, pp. 410-415.
Matsuda et al., "Simple-Structure, Generally Applicable Chip-Scale Package", 21 May 1995, Proceedings of the Electronic Components and Technology Conference, Las Vegas, May 21-24, 1995, pp. 218-223.
Lall et al, "Reliability Characterization of the SLICC Package", 28 May 1996, 1996 Proceedings of the 46th. Electronic Components and Technology Conference, Orlando, May 28-31, 1996, pp. 1202-1210.
BPA (Technology & Management) Ltd. , "Known Good Die and Chip Scale Packaging," BPA, Report No. 588, Sep. 1995, Surrey, UK.
Lawson Robert M.
Miremadi Jian
Arroyo Teresa M.
Hewlett--Packard Company
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