Area array semiconductor package and 3-dimensional stack...

Details Area array semiconductor package and 3-dimensional stack... Area array semiconductor package and 3-dimensional stack...

2005-01-25

2005-01-25

Picardat, Kevin M. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S685000, C257S723000, C438S107000, C438S112000

Reexamination Certificate

active

06847109

ABSTRACT:
An area array type semiconductor package suitable for use in the formation of a 3-dimensional stack of the area array type packages. The area array type semiconductor package includes a circuit board, typically a tape circuit board, a semiconductor chip, bonding wires, an encapsulation body, solder posts, and solder balls. A plurality of the area array type semiconductor packages can be electrically connected through the corresponding solder balls and solder posts on adjacent packages to form semiconductor stack packages.

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