Area array semiconductor device having a lid with functional con

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

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Details

257702, 257693, A01L 2302, A01L 2312

Patent

active

052910628

ABSTRACT:
An area array semiconductor device (10) having a lid with functional I/O contacts can be manufactured. In one embodiment, a semiconductor die (12) is mounted in a die cavity (16) of a substrate (14). A plurality of wire bonds (20) connect the die to conductive traces (18) on a surface of the substrate. A lid (22) having conductive traces (26) on an inner surface, which are electrically interconnected to an area array of contact pads (28) on an outer surface by a plurality of plated through-holes (30), is attached to the substrate with an anisotropic conductive adhesive (32). The adhesive electrically connects the conductive traces on the substrate to the conductive traces on the lid. A plurality of conductive pins (34) are attached to the area array of contact pads to provide one method of mounting the device to a board.

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