Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1993-03-01
1994-03-01
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257702, 257693, A01L 2302, A01L 2312
Patent
active
052910628
ABSTRACT:
An area array semiconductor device (10) having a lid with functional I/O contacts can be manufactured. In one embodiment, a semiconductor die (12) is mounted in a die cavity (16) of a substrate (14). A plurality of wire bonds (20) connect the die to conductive traces (18) on a surface of the substrate. A lid (22) having conductive traces (26) on an inner surface, which are electrically interconnected to an area array of contact pads (28) on an outer surface by a plurality of plated through-holes (30), is attached to the substrate with an anisotropic conductive adhesive (32). The adhesive electrically connects the conductive traces on the substrate to the conductive traces on the lid. A plurality of conductive pins (34) are attached to the area array of contact pads to provide one method of mounting the device to a board.
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Clark Minh-Hien N.
Clark Sheila V.
Motorola Inc.
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