Area array (flip chip) probe card

Details Area array (flip chip) probe card Area array (flip chip) probe card

1998-05-11

2000-10-10

Ballato, Josie

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324754, 324757, 324765, 439482, G01R 3102

Patent

active

061305464

ABSTRACT:
A method and apparatus for testing an integrated circuit die including a probe card (10) having a plurality of surface mount pads (45) arranged in a pattern (50) substantially corresponding to an area array pattern of die bumps (25) on the IC die. The pads and the die bumps are respectively electrically connected to each other with conductive probes (30). A plurality of test contacts (55) located around the periphery of the probe card (10) are in electrical contact to each surface mount pad (45) with electrical traces (65). An integrated circuit tester (60) having a plurality of test channels is electrically connected to a selected test contact (55) of the probe card (10), thereby forming a continuous conductive path between the integrated circuit tester (60) and the die bumps (25) on the IC die.

REFERENCES:
patent: 4038599 (1977-07-01), Bove et al.
patent: 5077598 (1991-12-01), Bartelink
patent: 5148103 (1992-09-01), Pasiecznik, Jr.
patent: 5258648 (1993-11-01), Lin
patent: 5500605 (1996-03-01), Chang
patent: 5534784 (1996-07-01), Lum et al.
patent: 5606263 (1997-02-01), Yoshizawa et al.
patent: 5701085 (1997-12-01), Malladi et al.

Affiliated with

Also associated with

Rating

Area array (flip chip) probe card does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Area array (flip chip) probe card, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Area array (flip chip) probe card will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2259613