Architecture for power modules such as power inverters

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electrical power distribution systems and devices

Reexamination Certificate

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C361S704000, C361S746000, C361S775000, C361S807000, C165S080200, C165S080300, C165S185000, C174S016300, C174S050510, C174S252000, C174S254000, C363S037000, C363S143000, C363S144000, C363S150000

Reexamination Certificate

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11010561

ABSTRACT:
Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

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