Architecture for power modules such as power inverters

Details Architecture for power modules such as power inverters Architecture for power modules such as power inverters

2007-11-27

2007-11-27

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electrical power distribution systems and devices

C361S704000, C361S746000, C361S775000, C361S807000, C165S080200, C165S080300, C165S185000, C174S016300, C174S050510, C174S252000, C174S254000, C363S037000, C363S143000, C363S144000, C363S150000

Reexamination Certificate

active

11010561

ABSTRACT:
Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

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