Architecture for dual-chip integrated circuit package and method

Details Architecture for dual-chip integrated circuit package and method Architecture for dual-chip integrated circuit package and method

1998-03-26

2000-10-17

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438111, 438112, 438127, H01L 2144, H01L 2148, H01L 2150

Patent

active

061330671

ABSTRACT:
An architecture for a dual-chip IC package and a method of manufacturing the same are provided. The dual-chip IC package allows two chips to be mounted on the same leadframe in the same package. The two chips can be either the same type of a semiconductor device or two different types of semiconductor devices with different functions such as a memory chip and a logic control chip. The architecture allows a simplified manufacturing process and an increased good yield rate for the two IC chips that are to be enclosed in the dual-chip IC package. Moreover, the dual-chip IC package can be manufactured with existing packaging equipment and processes, so that it can be realized without having to invest on and install additional ones.

REFERENCES:
patent: 5034350 (1991-07-01), Marchisi
patent: 5366933 (1994-11-01), Golwalkar et al.
patent: 5646829 (1997-07-01), Sota
patent: 5733802 (1998-03-01), Inoue et al.
patent: 5898220 (1999-04-01), Ball

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