4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Edward Chen

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Architecture for dual-chip integrated circuit package and method

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Patent

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Circuit pack

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Switch or casing therefor
Design Patent

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Equipment tray for simplified insertion and removal of...

Electricity: conductors and insulators – Conduits – cables or conductors – With interior conductor or cable supports
Reexamination Certificate

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Exercise apparatus

Exercise devices – User manipulated force resisting apparatus – component... – Having common force transmitting support frame for user and...
Reexamination Certificate

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Footwear outsole having arcuate inner-structure

Boots – shoes – and leggings – Boots and shoes – Resilient or flexible shoe
Reexamination Certificate

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Profile ID: LFUS-PAI-P-696419

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