Aqueous process for etching cooper and other metals

Details Aqueous process for etching cooper and other metals Aqueous process for etching cooper and other metals

1983-12-20

1985-02-05

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 156664, 156666, 156902, 252 792, 252 794, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

044976879

ABSTRACT:
Nitrogen dioxide process for etching copper and other metals, using water as a catalyst/solvent. In one disclosed embodiment, a film of water is formed on the surface of the metal, and the water-covered metal is exposed to gaseous NO.sub.2 to dissolve the metal. In another embodiment, the metal is exposed to an aqueous solution of NO.sub.2 or HNO.sub.3 in water, either by immersion or by spraying, to remove the metal.

REFERENCES:
patent: 1994499 (1935-03-01), Boller
patent: 2428464 (1947-10-01), Lum et al.
patent: 2647864 (1953-08-01), Goffredo
patent: 2798047 (1957-07-01), Touey et al.
patent: 2887373 (1959-05-01), Winkler et al.
patent: 2908557 (1959-10-01), Black et al.
patent: 2947615 (1960-08-01), Greene et al.
patent: 3373113 (1968-03-01), Achenbach
patent: 3449255 (1969-06-01), Johnston
patent: 3518132 (1970-06-01), Glendinning
patent: 3773578 (1973-01-01), Glendinning et al.
patent: 4007037 (1977-02-01), Lukes et al.
Kirk-Othmer, vol. 1, pp. 312, 313, 326 and 327, and vol. 5, pp. 145-149 (1979), Encyclopedia of Chemical Technology.

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