Aqueous dispersion for chemical/mechanical polishing

Details Aqueous dispersion for chemical/mechanical polishing Aqueous dispersion for chemical/mechanical polishing

2006-08-15

2006-08-15

Norton, Nadine G. (Department: 1765)

Compositions

Etching or brightening compositions

Inorganic acid containing

C438S692000, C438S693000, C438S700000, C216S089000, C216S090000, C216S103000, C451S036000

Reexamination Certificate

active

07090786

ABSTRACT:
The aqueous dispersion comprising (A) abrasive grains, (B) at least one compound selected from the group consisting of 2-bromo-2-nitro-1,3-propanediol, 2-bromo-2-nitro-1, 3-butanediol, 2,2-dibromo-2-nitroethanol, and 2,2-dibromo-3-nitrilopropionamide, and (C) an organic component other than the compounds of component (B) is disclosed. The aqueous dispersion has no problem of rotting even if stored or used in a neutral pH region and produces an excellent polished surface with almost no dishing or scratches, when applied particularly to the STI process for manufacturing of semiconductor devices.

REFERENCES:
patent: 3592893 (1971-07-01), Nosler et al.
patent: 6258140 (2001-07-01), Shemo et al.
patent: 2002/0045350 (2002-04-01), Kido et al.
patent: 3-197575 (1991-08-01), None
S. Wolf, Silicon Processing for the VLSI Era, vol. 4, (2002), Lattice Press, pp. 446-448.

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