Aqueous developing solutions for reduced developer residue

Details Aqueous developing solutions for reduced developer residue Aqueous developing solutions for reduced developer residue

1998-04-29

2000-05-16

Le, Hoa Van

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Finishing or perfecting composition or product

430493, G03F 732

Patent

active

060635509

ABSTRACT:
An alkaline aqueous developing solution for developing photoresists or the like contains, as an anti-scum agent, an ethoxylated surfactant having the general formula:

REFERENCES:
patent: 4613561 (1986-09-01), Lewis
patent: 4820621 (1989-04-01), Tanka et al.
patent: 4824769 (1989-04-01), Lewis et al.
patent: 4914006 (1990-04-01), Kato et al.
patent: 5030550 (1991-07-01), Kawabe et al.
patent: 5106724 (1992-04-01), Nogami et al.
patent: 5122438 (1992-06-01), Nogami et al.
patent: 5175078 (1992-12-01), Aoyama et al.
patent: 5217848 (1993-06-01), Uehara et al.
patent: 5340703 (1994-08-01), Masumi et al.
patent: 5364736 (1994-11-01), Eramo, Jr. et al.
patent: 5368982 (1994-11-01), Suzuki et al.
patent: 5393643 (1995-02-01), Lundy et al.
patent: 5457011 (1995-10-01), Lehr et al.
patent: 5532116 (1996-07-01), Suzuki et al.
patent: 5573893 (1996-11-01), Fujimoto et al.
patent: 5576145 (1996-11-01), Keil et al.
patent: 5595860 (1997-01-01), Ishikawa et al.
patent: 5609991 (1997-03-01), Brigugulio et al.
patent: 5731132 (1998-03-01), Van Werden et al.
patent: 5747224 (1998-05-01), Sato et al.

Affiliated with

Also associated with

Rating

Aqueous developing solutions for reduced developer residue does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Aqueous developing solutions for reduced developer residue, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Aqueous developing solutions for reduced developer residue will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-257165