Fishing – trapping – and vermin destroying
Patent
1993-03-19
1994-12-13
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437173, 437942, H01L 2102
Patent
active
053729749
ABSTRACT:
A method for reducing the effects of buckling, cracking, or wrinkling in multilayer heterostructures is provided. The method involves forming a planarization layer superjacent a semiconductor substrate. A barrier film having a structural integrity is formed superjacent the planarization layer by exposing the substrate to a gas and radiant energy. A second layer is formed superjacent the barrier film. The substrate is heated to cause the planarization layer to expand according to a first thermal coefficient of expansion, the second layer to expand according to a second thermal coefficient of expansion, and the structural integrity of the barrier film to be maintained. This results in the barrier film isolating the planarization layer from the second layer, thereby preventing the planarization layer and the second layer from interacting during the heating step. Further, it enables the planarization layer to go through a solid state reaction and the second layer to obtain a uniform reflow.
REFERENCES:
patent: 4870031 (1989-09-01), Sugahara et al.
patent: 5284804 (1994-02-01), Moslehi
Wolf et al., vol. I, Silicon Processing for the VLSI Era, Lattice Press, 1986 pp. 188-191.
Doan Trung T.
Liu Yauh-Ching
Thakur Randhir P. S.
Gurley Lynne A.
Hearn Brian E.
Micron Semiconductor Inc.
Pappas Lia M.
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