Application specific tape automated bonding

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430311, 430314, 430318, 430 5, 430273, 430503, 428137, 428 40, 29837, 29846, 257668, 257773, 437205, 437207, G03C 500

Patent

active

053785819

ABSTRACT:
A method for patterning a tape to which an integrated circuit may be bonded including providing a tape having a top layer of unexposed film which, when exposed in an interconnection pattern and developed, acts as a mask for processing a photoprocessable layer of the tape to provide conductive portions in an interconnection pattern on the tape.

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