Application of wire bond loop as integrated circuit package comp

Details Application of wire bond loop as integrated circuit package comp Application of wire bond loop as integrated circuit package comp

1997-12-24

1999-12-14

Booth, Richard

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438615, 438617, H01L 2144

Patent

active

060017236

ABSTRACT:
A method of forming an interconnection contact for integrated circuit package components includes providing an integrated circuit package component having a contact pad on which the interconnecting contact is to be formed. The interconnecting contact is formed by forming at least a portion of a bonding wire loop connected to the contact pad. A first end of a bonding wire is connected to the contact pad. The bonding wire loop includes a wire portion extending outwardly from the contact pad. The portion of the bonding wire loop forms the interconnection contact for electrically connecting the integrated circuit package component to other electrical devices. In one embodiment, a second end of the bonding wire loop is connected to the same contact pad that the first end of the bonding wire loop is connected to. In another embodiment, a second end of the bonding wire loop is connected to another contact pad. The integrated circuit package component may be an integrated circuit die or an interconnecting device such as an interconnecting substrate for interconnecting other integrated circuit package components or for connecting the integrated circuit package to other electrical elements. An encapsulating material may be used to encapsulate the particular surface of the integrated circuit package component, the contact pad, and portions of the bonding wire loop.

REFERENCES:
patent: 3310858 (1967-03-01), Johnson
patent: 3487272 (1969-12-01), Siebertz et al.
patent: 4631805 (1986-12-01), Olsen et al.
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5124277 (1992-06-01), Tsumura
patent: 5302550 (1994-04-01), Hirota et al.
patent: 5705425 (1998-01-01), Miura et al.
patent: 5710068 (1998-01-01), Hill
patent: 5723364 (1998-03-01), Nakamura et al.
patent: 5773311 (1998-06-01), Cullinan et al.
patent: 5830800 (1998-11-01), Lin
patent: 5874354 (1999-02-01), Heitzer et al.
patent: 5877033 (1999-03-01), Matern

Affiliated with

Also associated with

Rating

Application of wire bond loop as integrated circuit package comp does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Application of wire bond loop as integrated circuit package comp, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Application of wire bond loop as integrated circuit package comp will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-862962