Application of fluidized material to a substrate using displacem

Details Application of fluidized material to a substrate using displacem Application of fluidized material to a substrate using displacem

1992-11-30

1994-07-26

Jones, W. Gary

Paper making and fiber liberation

Processes and products

Cigarette paper

162186, 162109, 162135, 118211, 118262, 118264, 427210, 427286, 427428, D21H 2302, D21H 2500

Patent

active

053324722

ABSTRACT:
This invention relates to the treatment of substrates with fluidized material in repetitive patterns during application cycles. The treatment patterns made with this invention can be altered by changing machine operating parameters. The patterns of fluidized material are applied to substrates using an applicator drum. Machined in the outer surface of the applicator drum are a plurality of slots filled with deformable material. The deformable material extends to a position in each slot just short of the outside diameter of the applicator drum, leaving a cavity in each slot. These cavities are filled with slurry in a slurry applicator unit. A compression drum mounted within the hollow interior of the applicator drum uses compression tips to displace the deformable material in each slot in succession beyond the periphery of applicator drum at a position adjacent to the substrate, causing the slurry in the cavity to be applied to the substrate.

REFERENCES:
patent: 1393637 (1921-10-01), Ohashi
patent: 2056273 (1936-10-01), Holdsworth
patent: 2531036 (1950-11-01), Goettsch
patent: 2553592 (1951-05-01), Kucklinsky
patent: 2698574 (1955-01-01), Dougherty et al.
patent: 3107181 (1963-10-01), Bauder
patent: 3919973 (1975-11-01), Zimmer
patent: 3965817 (1976-06-01), Ipek
patent: 3988986 (1976-11-01), Zimmer

Affiliated with

Also associated with

Rating

Application of fluidized material to a substrate using displacem does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Application of fluidized material to a substrate using displacem, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Application of fluidized material to a substrate using displacem will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1051022