Apparatuses and methods for forming electronic assemblies

Details Apparatuses and methods for forming electronic assemblies Apparatuses and methods for forming electronic assemblies

2004-09-27

2008-08-26

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

C257SE23064

Reexamination Certificate

active

07417306

ABSTRACT:
Apparatuses and methods for forming microelectronic assemblies are claimed. One embodiment of the invention includes a contact smart card wherein fluidic self assembly is used to build the microelectronic structures on the microelectronic assembly such that a contact smart data is transmitted unidirectionally. A contact smart card is inserted directly into a device that transfers data to a microelectronic assembly coupled to the smart card. Another embodiment of the invention relates to a contactless smart card in which fluidic self assembly is also used here to build the microelectronic assembly. Data is transmitted to an antenna that is embedded in the contactless card in which a plurality of blocks were deposited thereon.

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