Apparatus to improve wafer temperature uniformity for...

Details Apparatus to improve wafer temperature uniformity for... Apparatus to improve wafer temperature uniformity for...

2007-05-29

2007-05-29

Tadesse, Yewebdar (Department: 1734)

Coating apparatus

Work holders, or handling devices

C118S052000, C118S730000, C118S725000, C118S058000

Reexamination Certificate

active

10680325

ABSTRACT:
A method and apparatus for controlling a substrate temperature during an electroless deposition process. The apparatus includes a deposition cell configured to support a substrate at a position above a fluid distribution member. A heated fluid is dispensed from the fluid distribution member and contacts the backside of the substrate, thus heating the substrate. The fluid is dispensed from apertures configured to maintain a constant temperature across the substrate surface. The method includes flowing a heated fluid through a diffusion member against a backside of the substrate in a configuration that is configured to generate a constant processing temperature across the front side or processing side of the substrate.

REFERENCES:
patent: 4432635 (1984-02-01), Mayer et al.
patent: 4758926 (1988-07-01), Herrell et al.
patent: 5566744 (1996-10-01), Tepman
patent: 5622593 (1997-04-01), Arasawa et al.
patent: 5720818 (1998-02-01), Donde et al.
patent: 5801442 (1998-09-01), Hamilton et al.
patent: 5824599 (1998-10-01), Schacham-Diamand et al.
patent: 5966940 (1999-10-01), Gower et al.
patent: 5998240 (1999-12-01), Hamilton et al.
patent: 6066575 (2000-05-01), Reardon et al.
patent: 6113702 (2000-09-01), Halpin et al.
patent: 6154369 (2000-11-01), Martinez, Jr. et al.
patent: 6177661 (2001-01-01), Lee et al.
patent: 6197150 (2001-03-01), Kwag et al.
patent: 6239038 (2001-05-01), Wen
patent: 6463938 (2002-10-01), Bran
patent: 6465765 (2002-10-01), Katayama et al.
patent: 6666949 (2003-12-01), Hillman et al.
patent: 2002/0083960 (2002-07-01), Wirth et al.
patent: 2002/0195128 (2002-12-01), Shibagaki
patent: 2003/0118732 (2003-06-01), Stevens et al.
patent: 2003/0181040 (2003-09-01), Ivanov et al.
patent: 2004/0052963 (2004-03-01), Ivanov et al.
patent: 2004/0084143 (2004-05-01), Ivanov et al.
patent: 2004/0094186 (2004-05-01), Ivanov
patent: 2004/0097071 (2004-05-01), Ivanov
patent: 2005/0072525 (2005-04-01), Pancham et al.
patent: 1 209 251 (2002-05-01), None
PCT International Search Report for PCT/US04/032879 dated Apr. 6, 2005.
PCT Written Opinion for PCT/US04/032879 dated Apr. 6, 2005.
Partial PCT Search Report for PCT/US04/032879 dated Jan. 11, 2005.

Affiliated with

Also associated with

Rating

Apparatus to improve wafer temperature uniformity for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus to improve wafer temperature uniformity for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus to improve wafer temperature uniformity for... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3721871