Apparatus, method and medium for enhancing the throughput of a w

Details Apparatus, method and medium for enhancing the throughput of a w Apparatus, method and medium for enhancing the throughput of a w

1996-05-28

1999-11-02

Grant, William

Boots, shoes, and leggings

36446808, 36446828, 36447801, 414936, 414937, 414938, 414939, 414940, 414941, 705 8, G06F 1900, G06G 766

Patent

active

059757400

ABSTRACT:
An apparatus, method and medium is provided for increasing the efficiency with which wafers are transferred among different processing chambers in a wafer processing facility. A multi-slot cooling chamber allows multiple wafers to be cooled while other wafers are subjected to processing steps in other chambers. Each wafer in the processing sequence is assigned a priority level depending on its processing stage, and this priority level is used to sequence the movement of wafers between chambers. A look-ahead feature prevents low-priority wafer transfers from occurring if such transfers would occur just prior to the scheduling of a high-priority wafer transfer.

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