Apparatus having a substrate and electronic circuit solder-conne

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond

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Details

257693, 257786, 361743, 361768, 361772, H01L 2348, H01L 2352

Patent

active

058380701

ABSTRACT:
An electronic circuit apparatus has first and second pad electrodes arranged on a substrate to be separated by a first interval, first and second chip electrodes to be separated by a second interval smaller than the first interval, a first solder for fixedly attaching the first chip electrode to the first pad electrode and a second solder for fixedly attaching the second chip electrode to the second pad electrode. Because the first interval is longer than the second interval, any constricted portion does not exist in each of the first and second solders. Therefore, because any stress is not concentrated on any portion of each of the first and second solders, the occurrence of a crack in each of the first and second solders can be prevented.

REFERENCES:
patent: 4673967 (1987-06-01), Hingorany
patent: 5239198 (1993-08-01), Lin et al.
patent: 5311399 (1994-05-01), Zell et al.
patent: 5338974 (1994-08-01), Wisherd et al.
patent: 5532910 (1996-07-01), Suzuki et al.
patent: 5548087 (1996-08-01), Dahringer
patent: 5621619 (1997-04-01), Seffernick et al.
"Eutectic Solder Preform for Solder Ball Connected Card Repairs" IBM Tech. Disc. Bulletin, vol. 37 No. 02b pp. 337-338, Feb. 1994.

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