Apparatus having a dielectric containing scandium and...

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S310000, C438S197000, C438S591000, C438S593000

Reexamination Certificate

active

08003985

ABSTRACT:
Apparatus having a dielectric containing scandium and gadolinium can provide a reliable structure with a high dielectric constant (high k). In an embodiment, atomic layer deposition (ALD) can be used to form a nanolaminate dielectric of gadolinium oxide (Gd2O3) and scandium oxide (Sc2O3) In an embodiment, a dielectric structure can be formed by depositing gadolinium oxide by atomic layer deposition onto a substrate surface using precursor chemicals, followed by depositing scandium oxide onto the substrate using precursor chemicals, and repeating to form the thin laminate structure. A dielectric containing scandium and gadolinium may be used as gate insulator of a MOSFET, a capacitor dielectric in a DRAM, as tunnel gate insulators in flash memories, as a NROM dielectric, or as a dielectric in other electronic devices, because the high dielectric constant (high k) of the film provides the functionality of a much thinner silicon dioxide film.

REFERENCES:
patent: 6495436 (2002-12-01), Ahn et al.
patent: 6509280 (2003-01-01), Choi
patent: 6514828 (2003-02-01), Ahn et al.
patent: 6534420 (2003-03-01), Ahn et al.
patent: 6608378 (2003-08-01), Ahn et al.
patent: 6632279 (2003-10-01), Ritala et al.
patent: 6638859 (2003-10-01), Sneh et al.
patent: 6661058 (2003-12-01), Ahn et al.
patent: 6700171 (2004-03-01), Landheer et al.
patent: 6767795 (2004-07-01), Ahn et al.
patent: 6777353 (2004-08-01), Putkonen
patent: 6787413 (2004-09-01), Ahn
patent: 6787421 (2004-09-01), Gilmer et al.
patent: 6803311 (2004-10-01), Choi
patent: 6844203 (2005-01-01), Ahn et al.
patent: 6844260 (2005-01-01), Sarigiannis et al.
patent: 6893984 (2005-05-01), Ahn et al.
patent: 6900122 (2005-05-01), Ahn et al.
patent: 6921702 (2005-07-01), Ahn et al.
patent: 6949787 (2005-09-01), Snyder et al.
patent: 6953730 (2005-10-01), Ahn et al.
patent: 6958302 (2005-10-01), Ahn et al.
patent: 6960538 (2005-11-01), Ahn et al.
patent: 7544596 (2009-06-01), Ahn et al.
patent: 2002/0192974 (2002-12-01), Ahn et al.
patent: 2002/0192975 (2002-12-01), Ahn
patent: 2003/0043637 (2003-03-01), Forbes et al.
patent: 2003/0045078 (2003-03-01), Ahn et al.
patent: 2003/0049942 (2003-03-01), Haukka et al.
patent: 2003/0059535 (2003-03-01), Luo et al.
patent: 2003/0207032 (2003-11-01), Ahn et al.
patent: 2003/0207540 (2003-11-01), Ahn et al.
patent: 2003/0227033 (2003-12-01), Ahn et al.
patent: 2003/0228747 (2003-12-01), Ahn et al.
patent: 2004/0007171 (2004-01-01), Ritala et al.
patent: 2004/0009679 (2004-01-01), Yeo et al.
patent: 2004/0043541 (2004-03-01), Ahn et al.
patent: 2004/0043569 (2004-03-01), Ahn et al.
patent: 2004/0043635 (2004-03-01), Vaartstra
patent: 2004/0110391 (2004-06-01), Ahn et al.
patent: 2004/0135186 (2004-07-01), Yamamoto
patent: 2004/0144980 (2004-07-01), Ahn et al.
patent: 2004/0164357 (2004-08-01), Ahn et al.
patent: 2004/0168627 (2004-09-01), Conley, Jr. et al.
patent: 2004/0171280 (2004-09-01), Conley, Jr. et al.
patent: 2004/0175882 (2004-09-01), Ahn et al.
patent: 2004/0183108 (2004-09-01), Ahn
patent: 2004/0185654 (2004-09-01), Ahn
patent: 2004/0203254 (2004-10-01), Conley, Jr. et al.
patent: 2004/0214399 (2004-10-01), Ahn et al.
patent: 2004/0222476 (2004-11-01), Ahn et al.
patent: 2004/0233010 (2004-11-01), Akram et al.
patent: 2004/0262700 (2004-12-01), Ahn et al.
patent: 2004/0266217 (2004-12-01), Kim et al.
patent: 2005/0009370 (2005-01-01), Ahn
patent: 2005/0020017 (2005-01-01), Ahn et al.
patent: 2005/0023594 (2005-02-01), Ahn et al.
patent: 2005/0023624 (2005-02-01), Ahn et al.
patent: 2005/0023625 (2005-02-01), Ahn et al.
patent: 2005/0023626 (2005-02-01), Ahn et al.
patent: 2005/0026349 (2005-02-01), Forbes et al.
patent: 2005/0029547 (2005-02-01), Ahn et al.
patent: 2005/0029604 (2005-02-01), Ahn et al.
patent: 2005/0029605 (2005-02-01), Ahn et al.
patent: 2005/0032292 (2005-02-01), Ahn et al.
patent: 2005/0037563 (2005-02-01), Ahn
patent: 2005/0054149 (2005-03-01), Xiang et al.
patent: 2005/0054165 (2005-03-01), Ahn et al.
patent: 2005/0077519 (2005-04-01), Ahn et al.
patent: 2005/0124175 (2005-06-01), Ahn et al.
patent: 2005/0140462 (2005-06-01), Akram et al.
patent: 2005/0145957 (2005-07-01), Ahn et al.
patent: 2005/0156256 (2005-07-01), Kim et al.
patent: 2005/0158973 (2005-07-01), Ahn et al.
patent: 2005/0164521 (2005-07-01), Ahn et al.
patent: 2005/0212119 (2005-09-01), Shero et al.
patent: 2005/0215015 (2005-09-01), Ahn et al.
patent: 2005/0218462 (2005-10-01), Ahn et al.
patent: 2005/0227442 (2005-10-01), Ahn et al.
patent: 2006/0183272 (2006-08-01), Ahn et al.
patent: 2007/0048989 (2007-03-01), Ahn et al.
patent: 2007/0158702 (2007-07-01), Doczy et al.
patent: 2007/0158765 (2007-07-01), Ahn et al.
Bender, H., et al., “Physical Characterisation of High-k Gate Stacks Deposited on HF-Last Surfaces”,Proceedings of the IWGI, Tokyo, (2001), 86-92.
Bender, H., et al., “Surface reconstruction of hydrogen annealed (100) silicon”,J. Appl. Phys. 75(12), (Jan. 15, 1994), 1207-1209.
Busch, B. W., et al., “Oxygen exchange and transport in thin zirconia films on Si(100)”,Physical Review B, vol. 62, No. 20, (Nov. 15, 2000), R13 290-R13 293.
Chang, J. P., et al., “Thermal stability of Ta2O5 in metal-oxide-metal capacitor structures”,Applied Physics Letters, vol. 74, No. 24, (Jun. 14, 1999), 3705-3707.
Cho, M. H., et al., “Enhanced thermal stability of high-dielectric Gd2O3 films using ZrO2incorporation”,Applied Physics Letters, vol. 84, No. 5, (Feb. 2, 2004), 678-680.
Choi, S. C., et al., “Epitaxial growth of Y2O3 films on Si(100) without an interfacial oxide layer”,Applied Physics Letters, vol. 71, No. 7, (Aug. 18, 1997), 903-905.
Copel, M., et al., “Structure and stability of ultrathin zirconium oxide layers on Si(001)”,Applied Physics Letters, 76(4), (Jan. 2000), 436-438.
Damlencourt, J.-F., et al., “Surface treatment for high-quality Al2O3and HfO2layers deposited on HF-dipped surface by atomic layer deposition”,Journal of Materials Science: Materials in Electronics 14, (2003), 379-382.
Endo, Kazuhiko, “Metal Organic Atomic Layer Deposition of High-k Gate Dielectrics Using Plasma Oxidation”,Japanese Journal of Applied Physics, 42, (2003), L685-L687.
Gupta, J. A., et al., “Gadolinium silicate gate dielectric films with sub-1.5 nm equivalent oxide thickness”,Applied Physics Letters, vol. 78, No. 12, (Mar. 19, 2001), 1718-1720.
Gusev, E. P., et al., “High-resolution depth profiling in ultrathin Al2O3films on Si”,Applied Physics Letters, 76(2), (Jan. 10, 2000), 176-178.
Haukka, Suvi, et al., “Surface coverage of ALE precursors on oxides”,Applied Surface Science 82/83, (1994), 548-552.
Hubbard, K. J., et al., “Thermodynamic stability of binary oxides in contact with silicon”,Journal of Materials Research, 11(11), (Nov. 1996), 2757-2776.
Ishii, Hiroyuki, “Growth and electrical properties of atomic-layer deposited ZrO2/Si-nitride stack gate dielectrics”,Journal of Applied Physics, 95(2), (Jan. 15, 2004), 536-542.
Jonsson, A. K., “Dielectric Permittivity and Intercalation Parameters of Li Ion Intercalated Atomic Layer Deposited ZrO2”,Journal of the Electrochemical Society, vol. 151, No. 3, (2004), F54-F58.
Lee, Byoung Hun, et al., “Ultrathin Hafnium Oxide with Low Leakage and excellent Reliability for Alternative Gate Dielectric Application”,IEEE Technical Digest of International Electron Devices 1999, (1999), 133-136.
Leskela, M., “ALD precursor chemistry: Evolution and future challenges”,J. Phys. IV France, 9, (1999), 837-852.
Loup, V., et al., “Reduced pressure chemical vapour deposition of Si/Si1-x-yGexCy heterostructures using a chlorinated chemistry”,Semiconductor Science and Technology 18, (2003), 352-360.
Paivasaari, Jani, et al., “A comparative study on lanthanide oxide thin films grown by atomic layer deposition”,Thin Solid Films, 472(1-2), First available online in 2004, (Aug. 13, 2004), 275-281.
Park, Dae-Gyu, et al., “Character

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus having a dielectric containing scandium and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus having a dielectric containing scandium and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus having a dielectric containing scandium and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2670181

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.