Apparatus for wafer patterning to reduce edge exclusion zone

Details Apparatus for wafer patterning to reduce edge exclusion zone Apparatus for wafer patterning to reduce edge exclusion zone

2006-05-12

2008-12-02

Nguyen, Hung Henry (Department: 2851)

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C355S067000

Reexamination Certificate

active

07460211

ABSTRACT:
An apparatus includes an edge expose unit for exposing an annular area in an edge exclusion zone of a wafer to radiation having a wavelength suitable for removing a film from the wafer in the annular area and a radiation modulator coupled to the edge expose unit for modulating the radiation to pattern the film in the annular area.

REFERENCES:
patent: 5361121 (1994-11-01), Hattori et al.
patent: 5811211 (1998-09-01), Tanaka et al.
patent: 5982474 (1999-11-01), Akiyama et al.
patent: 6052173 (2000-04-01), Miura et al.

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