Apparatus for wafer inspection

Details Apparatus for wafer inspection Apparatus for wafer inspection

2007-02-20

2007-02-20

Lauchman, Layla G. (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

C356S237300, C356S237400, C356S237500

Reexamination Certificate

active

10846624

ABSTRACT:
An apparatus for wafer inspection is described, comprising an incident-light illumination device (5) having an illumination axis and an imaging device (9) having an image axis, both of which are inclined with respect to one another and are directed onto a region to be inspected of the surface (42) of a wafer (2). According to the present invention, the apparatus is characterized in that the incident-light illumination device (5) and the imaging device (9, 19) each have associated with them a polarizing means whose transmission axes are oriented at a predetermined angle to one another.

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I. Peterson et al., “Lithography Defects: Reducing and Managing Yield Killers through Photo Cell Monitoring”, Yield Management Solutions, Spring 2000, pp. 17-24.

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