Apparatus for transporting wafer to and from polishing head

Details Apparatus for transporting wafer to and from polishing head Apparatus for transporting wafer to and from polishing head

1989-12-18

1992-03-17

Rachuba, Maurina

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51215R, 51277, 51215UE, B24B 500

Patent

active

050956612

ABSTRACT:
Apparatus for transporting a wafer into position against the pressure head of apparatus for polishing the wafer. The transport apparatus includes a dolly for positioning a wafer over a transport head assembly. The transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head. When the transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head, the transport head assembly only contacts the wafer at selected points at the periphery of the wafer.

REFERENCES:
patent: 4811522 (1989-03-01), Gill, Jr.
patent: 4944119 (1990-07-01), Gill, Jr.

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