Apparatus for transporting wafer to and from polishing head

Details Apparatus for transporting wafer to and from polishing head Apparatus for transporting wafer to and from polishing head

1988-06-20

1990-07-31

Rose, Robert

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51277, 51283R, B24B 4106

Patent

active

049441191

ABSTRACT:
Apparatus for transporting a wafer into position against the pressure head of apparatus for polishing the wafer. The transport apparatus includes a dolly for positioning a wafer over a transport head assembly. The transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head. When the transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head, the transport head assembly only contacts the wafer at selected points at the periphery of the wafer.

REFERENCES:
patent: 4811522 (1989-03-01), Gill, Jr.
patent: 4811523 (1989-03-01), Schmitz et al.

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