Coating apparatus – Gas or vapor deposition – Having means to expose a portion of a substrate to coating...
Patent
1986-01-27
1987-06-30
Pianalto, Bernard D.
Coating apparatus
Gas or vapor deposition
Having means to expose a portion of a substrate to coating...
118621, 118723, 118726, C23C 1600
Patent
active
046761942
ABSTRACT:
A method for forming a thin film on a substrate, which comprises aligning an evaporation means for an evaporating material to be deposited on the substrate, a plasma generating zone for dissociating an ion-forming gas into ions and electrons, an ion beam accelerating zone for accelerating the resulting ions and irradiating them onto the substrate, and said substrate on a substantially straight line in the order stated, and depositing a vapor of the evaporating material on the substrate through the plasma generating zone and the ion beam accelerating zone. According to this method, surface irradiation can be carried out uniformly because the ion species and the vapor atoms are irradiated in quite the same direction. Furthermore, the vapor atoms can be activated to a high degree, and the by-product electrons can be effectively utilized for the evaporation of the evaporant.
REFERENCES:
patent: 4152478 (1979-05-01), Takagi
Satou Mamoru
Yamaguchi Kouichi
Kyocera Corporation
Pianalto Bernard D.
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