Apparatus for thermocompression bonding

Details Apparatus for thermocompression bonding Apparatus for thermocompression bonding

1974-11-01

1976-04-06

Smith, Al Lawrence

Metal fusion bonding

Including means to force or clamp work portions together...

Work portion comprises electrical component

228180A, 228242, B23K 1900

Patent

active

039484297

ABSTRACT:
Leads are bonded to thin-film conductors on a substrate by the application of heat and pressure of a thermode. The thermode encloses a fusible material, adjacent its tip, which is heated and fused during the nonbonding portion of a bonding cycle. During the bonding portion of the bonding cycle, the fused material supplies the heat of fusion to the thermode tip when the tip contacts the leads. This helps maintain control of the tip temperature.

REFERENCES:
patent: 1350181 (1920-08-01), Remane
patent: 2534257 (1950-12-01), Flournoy
patent: 2935592 (1960-05-01), Thuillier
patent: 3099084 (1963-07-01), Thuillier
patent: 3442432 (1969-05-01), Santangini
Eleftherion "Assembling Beam-Lead Seal-Junction Integrated-Circuit Packages," The Western Electric Engineer, Dec. 1967, pp. 24-26.

Affiliated with

Also associated with

Rating

Apparatus for thermocompression bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for thermocompression bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for thermocompression bonding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1572359