Heat exchange – With retainer for removable article
Reexamination Certificate
2005-10-25
2005-10-25
Leo, Leonard R. (Department: 3753)
Heat exchange
With retainer for removable article
C165S080200, C034S393000, C034S510000, C118S724000, C118S725000, C118S728000, C392S416000, C392S418000
Reexamination Certificate
active
06957690
ABSTRACT:
Methods and apparatuses are provided for cooling semiconductor substrates prior to handling. In one embodiment, a substrate and support structure combination is lifted after high temperature processing to a cold wall of a thermal processing chamber, which acts as a heat sink. Conductive heat transfer across a small gap from the substrate to the heat sink speeds wafer cooling prior to handling the wafer (e.g., with a robot). In another embodiment, a separate plate is kept cool within a pocket during processing, and is moved close to the substrate and support after processing. In yet another embodiment, a cooling station between a processing chamber and a storage cassette includes two movable cold plates, which are movable to positions closely spaced on either side of the wafer.
REFERENCES:
patent: 3322577 (1967-05-01), Smith, Jr.
patent: 3656454 (1972-04-01), Shrader
patent: 4458427 (1984-07-01), Akeret
patent: 4566726 (1986-01-01), Correnti et al.
patent: 4717645 (1988-01-01), Kato et al.
patent: 4811493 (1989-03-01), Burgio, Jr.
patent: 4863547 (1989-09-01), Shidahara et al.
patent: 4868996 (1989-09-01), Ohmori et al.
patent: 4949783 (1990-08-01), Lakios et al.
patent: 5033407 (1991-07-01), Mizuno et al.
patent: 5080549 (1992-01-01), Goodwin et al.
patent: 5181556 (1993-01-01), Hughes
patent: 5199483 (1993-04-01), Bahng
patent: 5248370 (1993-09-01), Tsui et al.
patent: 5259883 (1993-11-01), Yamabe et al.
patent: 5318801 (1994-06-01), Snail et al.
patent: 5372648 (1994-12-01), Yamamoto et al.
patent: 5443997 (1995-08-01), Tsui et al.
patent: 5444217 (1995-08-01), Moore et al.
patent: 5447409 (1995-09-01), Grunes et al.
patent: 5447431 (1995-09-01), Muka
patent: 5520538 (1996-05-01), Muka
patent: 5520742 (1996-05-01), Ohkase
patent: 5607009 (1997-03-01), Turner et al.
patent: 5628121 (1997-05-01), Brooks et al.
patent: 5697427 (1997-12-01), Ngan et al.
patent: 5778968 (1998-07-01), Hendrickson et al.
patent: 5855681 (1999-01-01), Maydan et al.
patent: 5879461 (1999-03-01), Adams
patent: 5882413 (1999-03-01), Beaulieu et al.
patent: 5893950 (1999-04-01), Martinoni et al.
patent: 5937541 (1999-08-01), Weigand et al.
patent: 5970717 (1999-10-01), Tateyama
patent: 5974682 (1999-11-01), Akimoto
patent: 5991508 (1999-11-01), Ohmine et al.
patent: 6000227 (1999-12-01), Kroeker
patent: 6209220 (2001-04-01), Raaijmakers
patent: 6300600 (2001-10-01), Ratliff et al.
patent: 62 282437 (1987-08-01), None
patent: 03 138 369 (1991-06-01), None
patent: 03 224 236 (1991-10-01), None
patent: 04 176 121 (1992-06-01), None
patent: 05-13294 (1993-01-01), None
patent: 06-029203 (1994-02-01), None
patent: 07 045 536 (1995-02-01), None
patent: 07-254545 (1995-03-01), None
patent: 08-69977 (1996-03-01), None
patent: 08-162405 (1996-06-01), None
patent: 10-83960 (1998-03-01), None
patent: 93 26038 (1993-12-01), None
patent: 94 14185 (1994-06-01), None
ASM America Inc.
Knobbe Martens Olson & Bear LLP
Leo Leonard R.
LandOfFree
Apparatus for thermal treatment of substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for thermal treatment of substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for thermal treatment of substrates will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3446180