Apparatus for the treatment of semiconductor wafers in a fluid

Details Apparatus for the treatment of semiconductor wafers in a fluid Apparatus for the treatment of semiconductor wafers in a fluid

1995-07-26

1998-07-07

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

2611221, 1341022, 134902, B08B 310

Patent

active

057762961

ABSTRACT:
Provided is a process for removing organic materials from semiconductor wafers. The process involves the use of subambient deionized water with ozone absorbed into the water. The ozonated water flows over the wafers and the ozone oxidizes the organic materials from the wafers to insoluble gases. The ozonated water may be prepared in-situ by diffusing ozone into a tank containing wafers and subambient deionized water.
Also provided is a tank for the treatment of semiconductor wafers with a fluid and a gas diffuser for diffusion of gases directly into fluids in a wafer treatment tank.

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