Apparatus for the treatment and drying of semiconductor wafers i

Details Apparatus for the treatment and drying of semiconductor wafers i Apparatus for the treatment and drying of semiconductor wafers i

1996-07-02

1998-03-17

Coe, Philip R.

Cleaning and liquid contact with solids

Apparatus

Sequential work treating receptacles or stations with means...

34340, 134 952, 1341021, 134113, 134184, 261 181, 2611211, B08B 312

Patent

active

057275785

ABSTRACT:
Provided is a process for removing organic materials from semiconductor wafers and a process for chemical solvent drying of wafers. In the drying process, a wafer submerged in a bath having a lower aqueous layer and an upper organic layer is lifted from the lower aqueous layer up through the upper organic layer and removed from the bath. An apparatus for completing this process is also disclosed.

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