Apparatus for testing semicondctor wafer

Details Apparatus for testing semicondctor wafer Apparatus for testing semicondctor wafer

1994-08-25

1996-07-02

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324754, 324760, G01R 1073, G01R 3102

Patent

active

055326102

ABSTRACT:
The apparatus for collectively burning-in or testing a plurality of semiconductor chips disposed on a wafer without dicing the chips into individuals, the apparatus including a testing substrate, an active circuit disposed on the testing substrate for activating chips disposed on the wafer to be tested, a plurality of pads disposed on the testing substrate and positioned so that the pads are disposed in alignment with bonding pads of the chips disposed on the wafer when the testing substrate is overlaid on the wafer, and an anisotropic conductive layer disposed on the pads.

REFERENCES:
patent: 4585991 (1986-04-01), Reid et al.
patent: 4833402 (1989-05-01), Boegh-Petersen
patent: 5014161 (1991-05-01), Lee et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5140405 (1992-08-01), King et al.
patent: 5177439 (1993-01-01), Liu et al.
patent: 5206585 (1993-04-01), Chang et al.
patent: 5219765 (1993-06-01), Yoshida et al.
patent: 5367253 (1994-11-01), Wood et al.

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