Apparatus for testing a semiconductor package

Details Apparatus for testing a semiconductor package Apparatus for testing a semiconductor package

2008-07-02

2010-10-19

Tang, Minh N (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754090

Reexamination Certificate

active

07816937

ABSTRACT:
An apparatus for testing an object includes a test chamber, a guiding member, testing units and a transferring unit. The test chamber is configured to receive the object. The guiding member is arranged extending along a first direction in the test chamber. The testing units are movably connected to the guiding member to test electrical characteristics of the object. The transferring unit is arranged in the test chamber to load the object into one of the testing units and unload the object from one of the testing units. The testing units may be transferred to a position for repair without suspension of the apparatus. The object may be tested using another testing unit while the other testing unit is being repaired.

REFERENCES:
patent: 4856904 (1989-08-01), Akagawa
patent: 5166603 (1992-11-01), Hoshi
patent: 5614837 (1997-03-01), Itoyama et al.
patent: 5650732 (1997-07-01), Sakai
patent: 6882141 (2005-04-01), Kim
patent: 2006-337044 (2006-12-01), None
patent: 10-2004-0078244 (2004-09-01), None
patent: 10-0560729 (2006-03-01), None

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