Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1994-06-09
1995-07-11
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
257669, 29740, 361706, H01L 2348
Patent
active
054323800
ABSTRACT:
An LOC type semiconductor package and a fabricating method thereof comprises first and second through holes formed at inner leads and bus bars of the LOC-type lead frame, and third through holes formed at the tape which is bonded with the lower side of the inner leads and the bus bars, by pins at a tape cutter. Thus, air existing at both tape during the bonding process effectively flows out so as to prevent the trapping of air bubbles. Accordingly, during the wire bonding process, wire shorting and damage to the package body can be prevented. Since EMC is deposited into the first and the second through holes and supports the inner leads and the bus bars during the molding of the semiconductor package, the reliability of the semiconductor package can be improved.
REFERENCES:
patent: 3669333 (1972-06-01), Coucoulas
patent: 4916519 (1990-04-01), Ward
patent: 5108536 (1992-04-01), Sokulzusky et al.
patent: 5144412 (1992-09-01), Chang et al.
William C. Ward, Volume Production of Unique Plastic Surface-Mount Modules for the IBM-80-Ns 1-Mbit Dram Chip by Area Wire Bond Techniques, IBM General Technology Division, Essex Junction, Vermont, pp. 552-557.
Hong In P.
Jin Ho T.
Ko Chang E.
Donohoe Charles R.
Limanek Robert P.
Samsung Electronics Co,. Ltd.
Westerlund, Jr. Robert A.
Whitt Stephen R.
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