Apparatus for supporting semiconductor wafers and semiconductor

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438584, 4272481, 118500, 118728, C23C 1600

Patent

active

06133121&

ABSTRACT:
A plurality of rods are arranged between first and second plates. A plurality of support members formed of heat-resistant strings, for example, SiC are stretched between the rods and wafers are supported by the support members. The wafers are separated from the rods while they are supported on the support members.

REFERENCES:
patent: 5169684 (1992-12-01), Takagi
patent: 5192371 (1993-03-01), Shuto et al.
patent: 5219079 (1993-06-01), Nakamura
patent: 5443649 (1995-08-01), Sibley
patent: 5468112 (1995-11-01), Ishii et al.
patent: 5482559 (1996-01-01), Imai et al.
patent: 5494524 (1996-02-01), Inaba et al.
patent: 5507873 (1996-04-01), Ishizuka et al.
patent: 5534074 (1996-07-01), Koons

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for supporting semiconductor wafers and semiconductor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for supporting semiconductor wafers and semiconductor , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for supporting semiconductor wafers and semiconductor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-468168

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.