Apparatus for sputtering magnetic target materials

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

20429819, 20419212, C23C 1434

Patent

active

058765760

ABSTRACT:
Apparatus for sputtering magnetic target material using a magnetic field shunt within a moving magnet sputtering source. The apparatus includes a magnetic field shunt that is embedded into the target material along the path of the moving magnet assembly at a location where a deep erosion trench is created by the assembly in the target material. The magnetic field shunt provides an alternate path for the magnetic flux that is liberated by the erosion of the target. Alternatively, the magnetic field shunt is physically attached to the magnetic pole piece such that the magnetic shunt moves with the pole piece along the track that the pole piece is moved.

REFERENCES:
patent: 5320728 (1994-06-01), Tepman
patent: 5415754 (1995-05-01), Manley
patent: 5685959 (1997-11-01), Bourez et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for sputtering magnetic target materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for sputtering magnetic target materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for sputtering magnetic target materials will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-418704

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.