Apparatus for solder crack deflection

Stock material or miscellaneous articles – All metal or with adjacent metals – Laterally noncoextensive components

Reexamination Certificate

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Reexamination Certificate

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07923125

ABSTRACT:
An apparatus that includes a first component defining an interior of the apparatus; a first solder composition exterior to the first component; a second solder composition exterior to the first solder composition and the first component; and a second component exterior to the second solder composition, the first solder composition, and the first component.

REFERENCES:
patent: 5130779 (1992-07-01), Agarwala et al.
patent: 5461261 (1995-10-01), Nishiguchi
patent: 5551627 (1996-09-01), Leicht et al.
patent: 6046101 (2000-04-01), Dass et al.
patent: 6162660 (2000-12-01), LaFontaine et al.
patent: 6176947 (2001-01-01), Hwang et al.
patent: 6204089 (2001-03-01), Wang
patent: 6225206 (2001-05-01), Jimarez et al.
patent: 6281106 (2001-08-01), Higdon et al.
patent: 6373717 (2002-04-01), Downes et al.
patent: 6413849 (2002-07-01), Yeoh et al.
patent: 6429388 (2002-08-01), Interrante et al.
patent: 6444489 (2002-09-01), Lin
patent: 6492197 (2002-12-01), Rinne
patent: 6610591 (2003-08-01), Jiang et al.
patent: 6793116 (2004-09-01), Harada
patent: 2002/0051728 (2002-05-01), Sato et al.
patent: 2003/0222352 (2003-12-01), Kung et al.
patent: 2004/0079194 (2004-04-01), Nakata et al.
patent: 2004/0197955 (2004-10-01), Lee
patent: 2004/0219716 (2004-11-01), Warner et al.

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