Apparatus for simultaneous plating

Details Apparatus for simultaneous plating Apparatus for simultaneous plating

1995-02-21

1996-05-07

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429805, 20429825, 20429841, C23C 1434, C23C 1432

Patent

active

055142605

ABSTRACT:
The present invention relates to an apparatus for simultaneous plating with which arc ion plating and hollow cathode discharge (HCD) ion plating can be concurrently carried out in one chamber, and sputtering plating can also be performed in the other chamber while the former two types of platings are being performed. Since only one type of plating can be performed in one chamber with a conventional apparatus, there have been problems such as excessive installation cost and inferior plating quality. According to the present invention, simultaneous arc ion plating and HCD ion plating in one chamber and sputtering plating in the other one is possible, which may lower the installation cost and improve the plating quality.

REFERENCES:
patent: 4867859 (1989-09-01), Harada et al.
patent: 4877505 (1989-10-01), Bergmann
patent: 4992153 (1991-02-01), Bergmann et al.
patent: 5234561 (1993-08-01), Randhawa et al.
patent: 5413684 (1995-05-01), Bergmann
patent: 5427671 (1995-06-01), Ahmed
patent: 5454919 (1995-10-01), Hill et al.

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