Apparatus for shear testing bonds on silicon substrate

Details Apparatus for shear testing bonds on silicon substrate Apparatus for shear testing bonds on silicon substrate

2005-07-05

2005-07-05

Noori, Max (Department: 2855)

Measuring and testing

Specimen stress or strain, or testing by stress or strain...

By loading of specimen

Reexamination Certificate

active

06912915

ABSTRACT:
An apparatus for shear testing bonds on 8″ and 12″ silicon substrates. The apparatus includes a removable platform for securing the 8″ wafer and a vacuum chuck for securing a 12″ wafer and the removable platform at the same time. A control module controls a moving mechanism to shift a probe to contact the solder ball of the 12″ substrate secured on the vacuum chuck or the solder ball of the 8″ wafer on the removable platform when the removable platform is fixed on the vacuum chuck. The moving mechanism moves the probe in a direction to separate the solder ball from the wafer. A sensor measures the pulling force exerted on the probe when the probe is moved in a direction and separates the solder ball from the wafer.

REFERENCES:
patent: 4750141 (1988-06-01), Judell et al.
patent: 5641913 (1997-06-01), Watanabe
patent: 5969262 (1999-10-01), Ino et al.
patent: 6341530 (2002-01-01), Sykes

Affiliated with

Also associated with

Rating

Apparatus for shear testing bonds on silicon substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for shear testing bonds on silicon substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for shear testing bonds on silicon substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3415810