Apparatus for selective removal of material from wafer...

Cleaning and liquid contact with solids – Apparatus – With movable means to cause fluid motion

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C134S198000, C134S902000, C015S321000

Reexamination Certificate

active

06889698

ABSTRACT:
A process and apparatus for locally removing any material, such as a refractory metal, in particular tungsten, from any desired area of a wafer, such as an alignment mark area of a silicon wafer in process during the formation of integrated circuits thereon.

REFERENCES:
patent: 2568803 (1951-09-01), Guenst
patent: 3574239 (1971-04-01), Sollerud
patent: 3705437 (1972-12-01), Rukavina, Jr. et al.
patent: 3747155 (1973-07-01), Koellisch
patent: 3949771 (1976-04-01), Dodge et al.
patent: 4168562 (1979-09-01), Maasberg
patent: 4341568 (1982-07-01), Christensen
patent: 4611553 (1986-09-01), Iwata et al.
patent: 4750980 (1988-06-01), Hynecek
patent: 4872920 (1989-10-01), Flynn et al.
patent: 5125126 (1992-06-01), Bonnant
patent: 5158101 (1992-10-01), Sakka
patent: 5185056 (1993-02-01), Fuentes et al.
patent: 5223083 (1993-06-01), Cathey et al.
patent: 5271798 (1993-12-01), Sandhu et al.
patent: 5443653 (1995-08-01), Riley
patent: 5503594 (1996-04-01), Karubian et al.
patent: 5555902 (1996-09-01), Menon
patent: 5561884 (1996-10-01), Nijland et al.
patent: 5576831 (1996-11-01), Nikoonahad et al.
patent: 5576833 (1996-11-01), Miyoshi et al.
patent: 5603775 (1997-02-01), Sjoberg
patent: 5607818 (1997-03-01), Abram et al.
patent: 5646452 (1997-07-01), Narimatsu
patent: 5783044 (1998-07-01), Schneider et al.
patent: 6103636 (2000-08-01), Zahorik et al.
patent: 6243914 (2001-06-01), Studebaker
patent: 6269517 (2001-08-01), Dornier
patent: 6329301 (2001-12-01), Zahorik et al.
patent: 6447634 (2002-09-01), Zahorik et al.
patent: 6530113 (2003-03-01), Zahorik et al.
patent: 09-027482 (1997-01-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for selective removal of material from wafer... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for selective removal of material from wafer..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for selective removal of material from wafer... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3386589

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.