Apparatus for scribing semiconductor wafer with laser beam

Electric heating – Metal heating – By arc

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219121LY, B23K 2600

Patent

active

045434646

ABSTRACT:
An apparatus is adapted to scribe a semiconductor wafer with a laser beam in only one direction of an axis. The apparatus includes an XY table for placing the wafer thereon, a laser beam oscillator provided above the XY table, and an optical system for permitting the laser beam to be directed onto the wafer on the XY table. In order to scribe the wafer in only one direction, the apparatus further includes a light interrupting switch adapted to permit the laser beam to pass when the XY table is moved in only one direction in synchronism with an XY table driving motor and to permit the laser beam to be interrupted when the XY table is moved in the other directions.

REFERENCES:
patent: 3267249 (1966-08-01), Veth
patent: 4154530 (1979-05-01), Connolly, Jr. et al.
patent: 4190759 (1980-02-01), Hongo et al.
patent: 4224101 (1980-09-01), Tijburg et al.
patent: 4358658 (1982-11-01), Van Blarigan et al.

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