Apparatus for repairing a pattern film

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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20419234, 204298, 156345, 156626, 156627, 156635, 156643, 2504921, B23K 1500

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active

048510971

ABSTRACT:
The present invention relates to an apparatus for repairing a pattern film of a photomask, reticle, X-ray mask, semiconductor, etc. In the apparatus, a focused ion beam is applied to an excess portion of a pattern film which is formed on a substrate. The excess portion of the pattern film is removed by means of ion sputtering. For repairing an excess portion of the pattern film, an etching gas is provided to a position that is being irradiated with the scanning focused ion beam thereby increasing the reliability of repairing and carrying out repair of the excess portion of the pattern film with good quality. Further, the removal speed of the excess portion film is improved.

REFERENCES:
patent: 4609809 (1986-09-01), Yamaguchi et al.
patent: 4698236 (1987-10-01), Kellogg et al.
M. W. Geis et al., J. Vac. Sci. Technol., vol. 19, pp. 1390-1393 (1981).
S. Hosaka et al., J. Vac. Sci. Technol., vol. 16, pp. 913-917 (1979).
WO-A-8 602 774 (Ion Beam Systems), Publication date May 9, 1986.
Journal of Vacuum Science & Technology/B, vol. 3, No. 1, second series, Jan./Feb. 1985, pp. 67-70, Woodbury, N.Y., U.S.; Y. Ochiai, et al.: "Pressure and Irradiation Angle Dependence of Maskless Ion Beam Assisted Etching of GaAs and Si".

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