Apparatus for reducing polymer deposition on a substrate and...

Details Apparatus for reducing polymer deposition on a substrate and... Apparatus for reducing polymer deposition on a substrate and...

2007-08-07

2007-08-07

Kackar, Ram N. (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential etching apparatus including focus ring...

C156S345510, C156S345520, C156S345420, C156S053000, C118S715000, C118S728000, C118S724000

Reexamination Certificate

active

10251179

ABSTRACT:
An adjustable RF coupling ring is capable of reducing a vertical gap between a substrate and a hot edge ring in a vacuum processing chamber. The reduction of the gap reduces polymer deposits on the substrate and electrostatic chuck and improves wafer processing.

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