Apparatus for processing semiconductor wafers

Details Apparatus for processing semiconductor wafers Apparatus for processing semiconductor wafers

1994-07-26

1996-07-09

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 451287, 451533, 451548, 451921, B24B 3700, H01L 2100

Patent

active

055341063

ABSTRACT:
The invention is directed to a semi-conductor wafer processing machine including an arm having a wafer carrier disposed at one end. The wafer carrier is rotatable with the rotating motion imparted to a semi-conductor wafer held thereon. In first embodiment, the machine further includes a rotatable polishing pad having an upper surface divided into a plurality of wedge-shaped sections, including an abrasion section and a polishing section. The abrasion section has a relatively rough texture and the polishing section has a relatively fine texture as compared to each other. In an alternative embodiment, the pad includes an underlayer and surface layer. The surface layer includes two sections of differing hardness, both of which are harder than the underlayer. Alternatively, the surface layer may include one relatively hard section, and the underlayer may include two sections, one of which has the same hardness as the surface layer and the other of which is softer than the surface layer. In a further embodiment, the polishing pad has an annular shape, and a chemical processing table is disposed within the open central region of the pad.

REFERENCES:
patent: 45175 (1864-11-01), Randall
patent: 2309016 (1943-01-01), Ryan
patent: 2496352 (1950-02-01), Metzger et al.
patent: 3299579 (1967-01-01), Jacobson
patent: 3426486 (1969-02-01), Kubsh
patent: 3550325 (1970-12-01), Goetz et al.
patent: 3568371 (1971-03-01), Day et al.
patent: 3793779 (1974-02-01), Perrella
patent: 3844858 (1974-10-01), Bean
patent: 3878552 (1975-04-01), Rodgers
patent: 3969749 (1976-07-01), Bean
patent: 4219835 (1980-08-01), van Loon et al.
patent: 4255207 (1981-03-01), Nicolay et al.
patent: 4269636 (1981-05-01), Rivoli et al.
patent: 4417355 (1983-11-01), Anisovich et al.
patent: 4481738 (1984-11-01), Tabuchi
patent: 4481741 (1984-11-01), Bouladon et al.
patent: 4536949 (1985-08-01), Takayama et al.
patent: 4653231 (1987-03-01), Cronkhite et al.
patent: 4680893 (1987-07-01), Cronkhite et al.
patent: 4717681 (1988-01-01), Curran
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5081796 (1992-01-01), Schultz
patent: 5113421 (1992-05-01), Gignoux et al.
patent: 5177908 (1993-01-01), Tuttle
patent: 5196353 (1993-03-01), Sandhu et al.
patent: 5201987 (1993-04-01), Hawkins et al.
patent: 5222329 (1993-06-01), Yu
patent: 5240552 (1993-08-01), Yu et al.
patent: 5245794 (1993-09-01), Salugsugan
patent: 5257478 (1993-11-01), Hyde et al.
patent: 5265378 (1993-11-01), Rostoker
patent: 5297364 (1994-03-01), Tuttle
patent: 5308438 (1994-05-01), Cote et al.
patent: 5310455 (1994-05-01), Pasch et al.
patent: 5403228 (1995-04-01), Pasch
"Characterization of Inter-metal and Pre-metal Dielectric Oxides for Chemical Mechanical Polishing Process Integration", William Ong, Stuardo Robles, Sonny Sohn and Bang C. Nguyen, Jun. 8-9, 1993 VMIC Conference, 1993 ISMIC-102/93/0197, pp. 197-199.
"Chemical-mechanical Polishing: A New Focus on Consumables", Pete Singer, Semiconductor International, Feb. 1994, pp. 48-52.
"Inside Today's Leading Edge Microprocessors", Anthony Denboer, Semiconductor International, Feb. 1994, pp. 64-66.

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