Apparatus for processing a substrate wafer and method for operat

Details Apparatus for processing a substrate wafer and method for operat Apparatus for processing a substrate wafer and method for operat

1998-03-20

1999-12-07

Pelham, Joseph

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

392418, 118728, 374133, 374121, 374181, G01J 502

Patent

active

059987677

ABSTRACT:
An apparatus for processing a substrate wafer wherein the apparatus includes a reaction chamber, a wafer holder intended to hold the substrate wafer, and a susceptor. A temperature sensor, preferably a thermocouple with two junctions, is provided for measuring the difference between the temperatures at the site of the susceptor and at a site between the susceptor and the substrate wafer.

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patent: 5753891 (1998-05-01), Iwata et al.
patent: 5831249 (1998-11-01), Rohner et al.
Solid State Technology, "Temperature control slows RTP's advance", Dec. 1996, pp. 34 and 36.

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